NSN 8040-01-567-1799
Part Details | ADHESIVE
8040-01-567-1799 A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes CANADA BALSAM; CEMENT, WATCH JEWEL; FILM CEMENT, PHOTOGRAPHIC; GASKET CEMENT; and GASKET SHELLAC COMPOUND.
Alternate Parts: 90001583, 90-001583, OXYBOND 143T, OXY-BOND 143T, 8040-01-567-1799, 01-567-1799, 8040015671799, 015671799
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 80 | SEP 18, 2008 | 01-567-1799 | 11297 ( ADHESIVE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 8040-01-567-1799
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 90-001583 | 0JVX9 | RESIN TECHNOLOGY GROUP, LLCDBA RESIN TECHNOLOGY GROUP |
| OXY-BOND 143T | 0JVX9 | RESIN TECHNOLOGY GROUP, LLCDBA RESIN TECHNOLOGY GROUP |
Technical Data | NSN 8040-01-567-1799
| Characteristic | Specifications |
|---|---|
| MATERIAL | PLASTIC EPOXY |
| SPECIFIC USAGE DESIGN | FOR BONDING APPLICATIONS WHERE HIGH SHOCK IMPACT AND PEEL STRENGTH IS REQUIRED |
| RATED DRYING TIME | 18.000 HOURS NOMINAL |
| COLOR | GRAY |
| PHYSICAL FORM | PASTE |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 50.000 MILLILITERS |
| SPECIAL FEATURES | ROOM TEMPERATURE OR ELEVATED TEMPERATURE CURE; 18 HOUR CURE TIME AT ROOM TEMPERATURE, 2 HOUR CURE TIME AT 65 DEG C; SERVICE TEMPERATURE RANGE OF MINUS 60 DEG C TO PLUS 110 DEG C |
| SUPPLEMENTARY FEATURES | 50 MILLILITER CARTRIDGE; MINIMUM ORDER IS 50 CARTRIDGES; 5 TO 6 WEEK LEAD TIME |