NSN 8040-01-373-6643
Part Details | ADHESIVE
8040-01-373-6643 A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes CANADA BALSAM; CEMENT, WATCH JEWEL; FILM CEMENT, PHOTOGRAPHIC; GASKET CEMENT; and GASKET SHELLAC COMPOUND.
Alternate Parts: 1372PD1160, CHOBOND 592 AB, CHO-BOND 592 A/B, 500105920000, 50-01-0592-0000, 8040-01-373-6643, 01-373-6643, 8040013736643, 013736643
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
80 | APR 08, 1993 | 01-373-6643 | 11297 ( ADHESIVE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 8040-01-373-6643
Part Number | Cage Code | Manufacturer |
---|---|---|
1372PD1160 | 72314 | BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION I |
CHO-BOND 592 A/B | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
50-01-0592-0000 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
Technical Data | NSN 8040-01-373-6643
Characteristic | Specifications |
---|---|
MATERIAL | PLASTIC EPOXY |
SPECIFIC USAGE DESIGN | FOR ELECTRONICS BONDING APPLICATIONS |
RATED DRYING TIME | 1.000 HOURS NOMINAL |
COLOR | SILVER |
PHYSICAL FORM | LIQUID |
FEATURES PROVIDED | SEPARATE CATALYST AND HEAT VULCANIZE FEATURE |
QUANTITY WITHIN EACH UNIT PACKAGE | 1.000 POUNDS |
SPECIAL FEATURES | SILVER FILLED; ELECTRICALLY CONDUCTIVE; ELEVATED TEMPERATURE CURE; 1 HOUR AT 80 DEG C OR 5 MINUTES AT 150 DEG C |
SUPPLEMENTARY FEATURES | 1 POUND KIT |