NSN 5961-00-092-0519
Part Details | TRANSISTOR
5961-00-092-0519 An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes SEMICONDUCTOR DEVICE, DIODE and SEMICONDUCTOR DEVICE, THYRISTOR. For solid state devices which are responsive to visible or infrared radiant energy, see SEMICONDUCTOR DEVICE, PHOTO.
Alternate Parts: 4720569010, 472-0569-010, 877M6, 5961-00-092-0519, 00-092-0519, 5961000920519, 000920519
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | NOV 22, 1972 | 00-092-0519 | 20588 ( TRANSISTOR ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-092-0519
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 472-0569-010 | 94756 | BOEING COMPANY, THEDBA BOEING |
| 877M6 | 18722 | HARRIS CORPSEMICONDUCTOR SECTOR |
Technical Data | NSN 5961-00-092-0519
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | SILICON |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION |
| INCLOSURE MATERIAL | METAL |
| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| OVERALL LENGTH | 0.200 INCHES MAXIMUM |
| OVERALL DIAMETER | 0.710 INCHES MAXIMUM |
| NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| SPECIAL FEATURES | DESIGN ANALYSIS; JUNCTION PATTERN ARRANGEMENT: NPN |
| CRITICALITY CODE JUSTIFICATION | FEAT |