NSN 5961-00-052-2361
Part Details | SEMICONDUCTOR DEVICE ASSEMBLY
5961-00-052-2361 A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE.
Alternate Parts: 29328811, 29-32881-1, 5961-00-052-2361, 00-052-2361, 5961000522361, 000522361
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | MAY 16, 1967 | 00-052-2361 | 35565 ( SEMICONDUCTOR DEVICE ASSEMBLY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-00-052-2361
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 29-32881-1 | 81205 | THE BOEING COMPANYDBA BOEING |
Technical Data | NSN 5961-00-052-2361
| Characteristic | Specifications |
|---|---|
| MAJOR COMPONENTS | DIODE 4; PRINTED WIRING BOARD 1 |
| SPECIAL FEATURES | DESIGN ANALYSIS |
| CRITICALITY CODE JUSTIFICATION | FEAT |
| NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |