NSN 4430-01-300-0088
Part Details | GAS BURNING THERMAL DRYING OVEN
4430-01-300-0088 An oven in which heat is generated by a gas burning unit. It may be used for core, mold, coil, armature or paint baking, the preheating of plexi-glass or instrument drying. Excludes food baking ovens.
Alternate Parts: DCA336F, DCA-336F, 443000000000, 4430-0000-0000, 4430-01-300-0088, 01-300-0088, 4430013000088, 013000088
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 44 | MAY 09, 1989 | 01-300-0088 | 14840 ( OVEN, THERMAL DRYING, GAS BURNING ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 4430-01-300-0088
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| DCA-336F | 2N804 | BLUE M ELECTRIC COSUB OF GENERAL SIGNAL CORP |
| 4430-0000-0000 | 99998 | DEFENSE SUPPLY CENTER RICHMONDINDUSTRIAL PLANT EQUIPMENT /DLA/ |
Technical Data | NSN 4430-01-300-0088
| Characteristic | Specifications |
|---|---|
| CIRCULATION METHOD | FORCED |
| WORK PROTECTION FROM HEAT SOURCE | COMPLETE |
| WATTAGE RATING | 8.0 KILOWATTS |
| CURRENT TYPE | DC |
| VOLTAGE IN VOLTS | 240.0 |
| FREQUENCY IN HERTZ | 60.0 |
| PHASE | SINGLE |
| MAXIMUM OPERATING TEMP | 316.0 DEG CELSIUS |
| NORMAL OPERATING TEMP RANGE | +1.0 TO +316.0 DEG CELSIUS |
| TEMP CONTROL METHOD | AUTOMATIC |
| INSIDE WIDTH | 25.000 INCHES NOMINAL |
| INSIDE DEPTH | 20.000 INCHES NOMINAL |
| INSIDE HEIGHT | 38.000 INCHES NOMINAL |
| OVERALL WIDTH | 43.000 INCHES NOMINAL |
| OVERALL DEPTH | 33.000 INCHES NOMINAL |
| OVERALL HEIGHT | 83.000 INCHES NOMINAL |
| CABINET DOUBLE WALL CONSTRUCTION | PROVIDED |
| INSULATED CABINET | PROVIDED |
| CABINET DOOR QUANTITY | 2 |
| CABINET EXHAUST VENT | PROVIDED |
| ADJUSTABLE OPENING | PROVIDED |
| CABINET FRESH AIR INTAKE | NOT PROVIDED |
| SPECIAL FEATURES | INSIDE CAPACITY: 11.0 CU FT; TEMPERATURE RANGE: STARTS FROM 15 DEG C ABOVE AMBIENT; GAS FOR WHICH DESIGNED: ANY NON-FLAMMABLE GAS,INCLUDING NITROGEN,ARGON,HELIUM,AND CARBON DIOXIDE;AUTOMATIC GAS PURGE FOR RAPID COOL DOWN |
| FUNCTIONAL DESCRIPTION | USED TO BAKE EPOXIES AND FILM ADHESIVES USED IN THE ASSEMBLY OF HYBRID MICROCIRCUITS FOR AVIONICS |