NSN 5935-00-058-1083
Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET
5935-00-058-1083 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".
Alternate Parts: 80691G2, 8069-1G2, 80691G2, 8069-1G2, 5935-00-058-1083, 00-058-1083, 5935000581083, 000581083
Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
---|---|---|---|
59 | JAN 12, 1968 | 00-058-1083 | 28914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS ) |
REFERENCE DRAWINGS & PICTURES
TOP MOUNT, PRESS FIT

ROUND, W/KEYWAY

CIRCULAR

Cross Reference | NSN 5935-00-058-1083
Part Number | Cage Code | Manufacturer |
---|---|---|
8069-1G2 | 91506 | AUGAT INC |
8069-1G2 | 00779 | TE CONNECTIVITY CORPORATIONDBA TE CONNECTIVITY |
Technical Data | NSN 5935-00-058-1083
Characteristic | Specifications |
---|---|
CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR |
ACCOMMODATED CONTACT QUANTITY | 4 |
CONTACT MATERIAL | COPPER ALLOY |
CONTACT SURFACE TREATMENT | U0000 ANY ACCEPTABLE AND NICKEL |
BODY STYLE | TOP MOUNT, PRESS FIT |
TERMINAL LENGTH | 0.125 INCHES NOMINAL |
OVERALL HEIGHT | 0.204 INCHES NOMINAL |
OVERALL DIAMETER | 0.375 INCHES NOMINAL |
PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL |
BODY MATERIAL | GLASS, EPOXY |
TERMINAL TYPE AND QUANTITY | 4 PIN |
MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
MOUNTING METHOD | PRESS FIT |
MOUNTING HOLE STYLE | ROUND, W/KEYWAY |
BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.375 INCHES NOMINAL |
BUSHING HOLE AND KEYWAY LENGTH | 0.435 INCHES NOMINAL |
POLARIZATION TYPE | CENTER KEY HOLE |
SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
FABRICATION METHOD | MOLDED |
PRECIOUS MATERIAL | GOLD |
PRECIOUS MATERIAL AND WEIGHT | 0.020 GOLD GRAINS, TROY |
PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |