NSN 5935-00-058-1083

Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET

5935-00-058-1083 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".

Alternate Parts: 80691G2, 8069-1G2, 80691G2, 8069-1G2, 5935-00-058-1083, 00-058-1083, 5935000581083, 000581083

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 12, 196800-058-108328914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS )
REFERENCE DRAWINGS & PICTURES

TOP MOUNT, PRESS FIT

SOCKET,PLUG-IN ELEC | 5935-00-058-1083, 000581083

ROUND, W/KEYWAY

SOCKET,PLUG-IN ELEC | 5935-00-058-1083, 000581083

CIRCULAR

SOCKET,PLUG-IN ELEC | 5935-00-058-1083, 000581083
Cross Reference | NSN 5935-00-058-1083
Part Number Cage Code Manufacturer
8069-1G291506AUGAT INC
8069-1G200779TE CONNECTIVITY CORPORATIONDBA TE CONNECTIVITY
Technical Data | NSN 5935-00-058-1083
Characteristic Specifications
CONTACT POSITION ARRANGEMENT STYLE CIRCULAR
ACCOMMODATED CONTACT QUANTITY4
CONTACT MATERIAL COPPER ALLOY
CONTACT SURFACE TREATMENTU0000 ANY ACCEPTABLE AND NICKEL
BODY STYLE TOP MOUNT, PRESS FIT
TERMINAL LENGTH0.125 INCHES NOMINAL
OVERALL HEIGHT0.204 INCHES NOMINAL
OVERALL DIAMETER0.375 INCHES NOMINAL
PROJECTION LENGTH ABOVE MOUNTING SURFACE0.062 INCHES NOMINAL
BODY MATERIAL GLASS, EPOXY
TERMINAL TYPE AND QUANTITY4 PIN
MOUNTING TYPE FOR WHICH DESIGNED CHASSIS
MOUNTING METHOD PRESS FIT
MOUNTING HOLE STYLE ROUND, W/KEYWAY
BODY MOUNTING HOLE ACCOMMODATION DIAMETER0.375 INCHES NOMINAL
BUSHING HOLE AND KEYWAY LENGTH0.435 INCHES NOMINAL
POLARIZATION TYPE CENTER KEY HOLE
SPECIFIC EQUIPMENT ACCOMMODATEDSEMICONDUCTOR DEVICE
FABRICATION METHOD MOLDED
PRECIOUS MATERIAL GOLD
PRECIOUS MATERIAL AND WEIGHT0.020 GOLD GRAINS, TROY
PRECIOUS MATERIAL AND LOCATIONCONTACT SURFACES GOLD